Concepedia

Pattern Plating

Pattern Plating is a selective electroless plating technique in which metal deposition is restricted to predefined regions of a substrate through the use of masking patterns, thereby enabling the fabrication of conductive circuitry without the need for external electrical current.

11

Publications

311

Citations

49

Authors

16

Institutions

Publications per year

2017–2026

2

Parents

Publications

11

Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition

Yuanming Chen, Wei He, Xian‐Ming Chen et al. · Electrochimica Acta · 2014 · 101 citations

, , +14

Comparison of Metacarpal Plating Methods

Roger C. Sohn, Kenneth H. Jahng, Shane Curtiss et al. · The Journal Of Hand Surgery · 2008 · 47 citations

, , +3

Novel Low Cost Integration of Through Chip Interconnection and Application to CMOS Image Sensor

Masahiro Sekiguchi, Hideo Numata, Naoki Sato et al. · 2006 · 38 citations

, , +17

Some Practical Aspects of Electroless Gold Plating

Y. Okinaka, R. Sard, C. Wolowodiuk et al. · Journal of The Electrochemical Society · 1974 · 29 citations

, , +14

Direct Copper Pattern Plating on Glass and Ceramic Substrates Using an Al-Doped ZnO as an Adhesive and Conducting Layer

Chia-Wen Cheng, Po-Fan Chan, Wei‐Ping Dow · Journal of The Electrochemical Society · 2017 · 19 citations · Full text

, , +14

1–5 of 11

Authors

49

  1. YC
    Yuanming Chen

    University of Electronic Science and Technology of China, China

    2 publications · 114 citations

    2

    h-index

  2. SW
    Shouxu Wang

    University of Electronic Science and Technology of China, China

    2 publications · 114 citations

    2

    h-index

  3. CW
    Chong Wang

    University of Electronic Science and Technology of China, China

    2 publications · 114 citations

    2

    h-index

  4. WH
    Wei He

    University of Electronic Science and Technology of China, China

    2 publications · 114 citations

    2

    h-index

  5. TR
    T.F. Retajczyk

    Murray State University, United States

    1 publications · 29 citations

    1

    h-index

1–5 of 49

Institutions

16

  1. University of Electronic Science and Technology of China

    Chengdu, China

    2 h-index

    12 publications

    684 citations

  2. Harbin University

    Harbin, China

    1 h-index

    3 publications

    30 citations

  3. State University of New York

    Albany, United States

    1 h-index

    3 publications

    30 citations

  4. University of California Davis Medical Center

    Sacramento, United States

    1 h-index

    4 publications

    188 citations

  5. Buffalo BioLabs

    Buffalo, United States

    1 h-index

    3 publications

    30 citations

  6. National Engineering Research Center of Electromagnetic Radiation Control Materials

    Chengdu, China

    1 h-index

    6 publications

    606 citations

  7. National Chung Hsing University

    Taichung, Taiwan

    1 h-index

    3 publications

    57 citations

  8. University at Buffalo, State University of New York

    Buffalo, United States

    1 h-index

    4 publications

    40 citations

1–8 of 16

Venues

  1. Journal of The Electrochemical Society

    JES · 4 publications · 77 citations

    4

    h-index

  2. 1

    h-index

  3. Applied Physics Letters

    1 publications · 14 citations

    1

    h-index

  4. Circuit World

    CW · 1 publications · 13 citations

    1

    h-index

  5. Electrochimica Acta

    1 publications · 101 citations

    1

    h-index

1–5