Publication | Closed Access

Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition

Materials ScienceWafer Scale ProcessingEngineeringBeam LithographyMicrofabricationSurface ScienceApplied PhysicsAdditive-assisted ElectrodepositionElectrochemical InterfaceBottom-up Copper PillarsElectronic PackagingMicroelectronicsIc Substrates3D PrintingNanolithography Method