Mold Compound Encapsulation is a hermetic sealing technique in MEMS packaging that belongs to the class of physical protection methods, distinguished by its use of thermosetting polymer materials injected into a mold cavity to encase MEMS devices for environmental and mechanical protection.
5
Publications
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Citations
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Authors
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Institutions
Publications per year
2017–2026
1
Variants
Molding Compound Encapsulation
Parents
Publications
5
1–5 of 5
Authors
11
- AA
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- SC
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- CP
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- SD
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- LMLeo M. Higgins
1 publications · 10 citations
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1–5 of 11
Institutions
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Motorola (United States)
Schaumburg, United States
1 h-index
1 publications
83 citations
Life Cycle Engineering (United States)
Charleston, United States
1 h-index
3 publications
30 citations
Olin Corporation (United States)
Clayton, United States
1 h-index
1 publications
21 citations
University of Maryland, College Park
College Park, United States
1 h-index
3 publications
30 citations
Schlumberger (United States)
Houston, United States
1 h-index
2 publications
20 citations
1–5 of 5
Venues
- IEEE Transactions on Components Hybrids and Manufacturing Technology
1 publications · 83 citations
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- Microelectronics Reliability
1 publications · 10 citations
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- IMAPSource Proceedings
1 publications · 10 citations
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