Concepedia

Steven Dunford

SD

Statistics

Publications

4

Citations

99

H-Index

4

Active since

2003

Affiliations

Nokia (United States)(Current)

Steven Dunford is an author at Nokia (United States) specializing in materials science, engineering, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicrostructureApplied PhysicsMaterials EngineeringMechanical EngineeringCorrosionNanomaterialsNanotechnology

Publications per year

2003–2018

4

Publications

4

Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections

Steven Dunford, S. Canumalla, P. Viswanadharn · 2004 · 53 citations

Engineering, Intermetallic Morphologies, Mechanical Engineering +20

Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy

Jae-Yong Park, Rajendra Kabade, Choong-Un Kim et al. · Journal of Electronic Materials · 2003 · 24 citations

Materials Science, Materials Engineering, Engineering +6

Flexible circuit creation with nano metal particles

W. Peng, Ville Hurskainen, Kenichi Hashizume et al. · 2005 · 12 citations

Engineering, Nanocomputing, Nmp Ag Traces +18

Aging Characteristics of Green Mold Compound for Use in Encapsulation of Microelectronic Devices

Subramani Manoharan, Chandradip Patel, Steven Dunford et al. · 2018 · 10 citations

Epoxy 'Green, Engineering, Mechanical Engineering +18

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