S. Canumalla

Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections

Steven Dunford, S. Canumalla, P. Viswanadharn · 2004 · 53 citations

Engineering, Intermetallic Morphologies, Mechanical Engineering +20

Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: transducer selection

S. Canumalla · IEEE Transactions on Components and Packaging Technologies · 1999 · 46 citations

Biomedical Acoustics, Engineering, Microscopy +19

Mechanical Behavior of Mullite Fiber Reinforced Aluminum Alloy Composites

S. Canumalla, S. A. Dynan, D. J. Green et al. · Journal of Composite Materials · 1995 · 37 citations

Materials Science, Room Temperature, Fiber Reinforcement +11

Ultrasonic C-scan imaging for material characterization

Grant A. Gordon, S. Canumalla, Bernhard R. Tittmann · Ultrasonics · 1993 · 28 citations

Engineering, Health Sciences, Medical Imaging +9

Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure

S. Canumalla, H.-D. Yang, Puligandla Viswanadham et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 26 citations

Pwb Build-up Layer, Engineering, Mechanical Engineering +16