Concepedia

H.-D. Yang

HY

2

Publications

250

Citations

2

H-Index

2004

Active since

Affiliations

Korea University(Current)

H.-D. Yang is an author at Korea University specializing in engineering, mechanics of materials, and electronic packaging.

Top concepts

EngineeringHealthBiometricsData ScienceSign LanguageImage AnalysisMachine VisionComputer VisionComputer ScienceMachine Learning

Publications per year

2004–2009

2

Publications

2

Sign Language Spotting with a Threshold Model Based on Conditional Random Fields

H.-D. Yang, S. Sclaroff, S.-W. Lee · IEEE Transactions on Pattern Analysis and Machine Intelligence · 2009 · 224 citations

Engineering, Machine Learning, Biometrics +21

Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure

S. Canumalla, H.-D. Yang, Puligandla Viswanadham et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 26 citations

Pwb Build-up Layer, Engineering, Mechanical Engineering +16

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