Puligandla Viswanadham

Comparative interference study for atomic absorption lead determinations using a constant temperature vs. a pulsed-type atomizer

Lynn R Hageman, John Nichols, Puligandla Viswanadham et al. · Analytical Chemistry · 1979 · 35 citations

Engineering, Atomic Emission Spectroscopy, Altmetric Attention Score +19

Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure

S. Canumalla, H.-D. Yang, Puligandla Viswanadham et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 26 citations

Pwb Build-up Layer, Engineering, Mechanical Engineering +16

Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy

Jae-Yong Park, Rajendra Kabade, Choong-Un Kim et al. · Journal of Electronic Materials · 2003 · 24 citations

Materials Science, Materials Engineering, Engineering +6

Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys

Jae-Yong Park, Choong-Un Kim, Ted Carper et al. · Journal of Electronic Materials · 2003 · 19 citations

Materials Science, Engineering, Sn-ag-cu Eutectic Solder +5

Thermodynamic properties of calcium aluminates

I. Eliezer, Naomi Eliezer, Reed A. Howald et al. · The Journal of Physical Chemistry · 1981 · 18 citations

Engineering, Chemical Analysis, Altmetric Attention Score +17