Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 557 citations

Natural Sciences, Materials Engineering, Materials Science +14

A thermodynamic assessment of the Au-Cu system

Bo Sundman, Suzana G. Fries, W.A. Oates · Calphad · 1998 · 135 citations

Natural Sciences, Materials Engineering, Materials Science +14

Fast dissolution and soldering reactions on Au foils

P. G. Kim, K. N. Tu · Materials Chemistry and Physics · 1998 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +12

Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

Cheng–En Ho, Y. M. Chen, C. R. Kao · Journal of Electronic Materials · 1999 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +16

Gold coatings for fluxless soldering

David M. Jacobson, G. Humpston · Gold bulletin · 1989 · 63 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14