Concepedia

Miniaturized Package Structures

Miniaturized Package Structures is a microwave packaging innovation that integrates compact, high-density electromagnetic components into a singular, reduced-form-factor physical layout to enable enhanced signal integrity and thermal management in advanced wireless systems.

31

Publications

725

Citations

146

Authors

49

Institutions

Publications per year

2017–2026

5

Parents

Publications

31

Miniaturized Dual-Band Broadside/Endfire Antenna-in-Package for 5G Smartphone

Jungwoo Seo, Inseop Yoon, Jaebaek Jung et al. · IEEE Transactions on Antennas and Propagation · 2021 · 97 citations

, , +16

Development of self-packaged high frequency circuits using micromachining techniques

L.P.B. Katehi · IEEE Transactions on Microwave Theory and Techniques · 1995 · 63 citations

, , +16

Micromachined circuits for millimeter- and sub-millimeter-wave applications

L.P.B. Katehi, Gabriel M. Rebeiz, T. Weller et al. · IEEE Antennas and Propagation Magazine · 1993 · 59 citations

, , +16

Suppression of EMI and Electromagnetic Noise in Packages Using Embedded Capacitance and Miniaturized Electromagnetic Bandgap Structures With High-k Dielectrics

Baharak Mohajer‐Iravani, Omar M. Ramahi · IEEE Transactions on Advanced Packaging · 2007 · 44 citations

, , +16

Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias

Yangquan Su, Daquan Yu, Wenbiao Ruan et al. · IEEE Electron Device Letters · 2022 · 40 citations

, , +17

1–5 of 31

Authors

146

  1. OM
    Omar M. Ramahi

    University of Waterloo, Canada

    3 publications · 71 citations

    3

    h-index

  2. BM
    Baharak Mohajer‐Iravani

    University of Maryland, College Park, United States

    2 publications · 56 citations

    2

    h-index

  3. LK
    L.P.B. Katehi

    University of Michigan, United States

    2 publications · 122 citations

    2

    h-index

  4. WL
    Woncheol Lee

    University of Alabama, United States

    1 publications · 97 citations

    1

    h-index

  5. AF
    A. Fung

    Jet Propulsion Laboratory, United States

    1 publications · 12 citations

    1

    h-index

1–5 of 146

Institutions

49

  1. University of Maryland, College Park

    College Park, United States

    3 h-index

    4 publications

    86 citations

  2. University of Waterloo

    Waterloo, Canada

    2 h-index

    4 publications

    112 citations

  3. University of Michigan

    Ann Arbor, United States

    2 h-index

    8 publications

    480 citations

  4. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    12 publications

    132 citations

  5. Hitachi (Japan)

    Tokyo, Japan

    1 h-index

    7 publications

    70 citations

  6. Zhejiang University

    Hangzhou, China

    1 h-index

    4 publications

    88 citations

  7. Ministry of Industry and Information Technology

    Beijing, China

    1 h-index

    1 publications

    22 citations

  8. Singapore Science Park

    Singapore, Singapore

    1 h-index

    5 publications

    100 citations

1–8 of 49

Venues

  1. 1

    h-index

  2. IEEE Nanotechnology Magazine

    1 publications · 14 citations

    1

    h-index

  3. Microelectronics Reliability

    1 publications · 20 citations

    1

    h-index

  4. IEEE Transactions on Antennas and Propagation

    1 publications · 97 citations

    1

    h-index

  5. IEEE Electron Device Letters

    1 publications · 40 citations

    1

    h-index

1–5