Concepedia

Integration Of Mems Components

Integration of MEMS Components is a fabrication strategy within surface micromachining that enables the monolithic co-fabrication of multiple micro-electromechanical systems elements on a single substrate to achieve multifunctional device operation.

312

Publications

12.4K

Citations

1.2K

Authors

260

Institutions

Publications per year

2017–2026

41

Parents

Publications

312

A BioMEMS Review: MEMS Technology for Physiologically Integrated Devices

Amy C. Richards Grayson, Rebecca S. Shawgo, Audrey M. Johnson et al. · Proceedings of the IEEE · 2004 · 559 citations

, , +17

The Use of Functionally Graded Poly-SiGe Layers for MEMS Applications

Ann Witvrouw, Ankit Nalin Mehta · Materials science forum · 2005 · 330 citations · Full text

, , +17

Integrated three-dimensional microelectromechanical devices from processable carbon nanotube wafers

Yuhei Hayamizu, Takeo Yamada, Kohei Mizuno et al. · Nature Nanotechnology · 2008 · 285 citations

, , +14

Single-chip surface micromachined integrated gyroscope with 50°/h Allan deviation

J.A. Geen, S. Sherman, John Chang et al. · IEEE Journal of Solid-State Circuits · 2002 · 273 citations

, , +16

Self-assembly from milli- to nanoscales: methods and applications

Massimo Mastrangeli, Shaghayegh Abbasi, Cagdac Varel et al. · Journal of Micromechanics and Microengineering · 2009 · 253 citations · Full text

, , +17

1–5 of 312

Authors

1.2K

  1. ME
    Masayoshi Esashi

    Tohoku University, Japan

    7 publications · 246 citations

    7

    h-index

  2. WF
    Weileun Fang

    National Tsing Hua University, Taiwan

    6 publications · 233 citations

    6

    h-index

  3. CT
    Clark T.‐C. Nguyen

    University of Michigan, United States

    5 publications · 111 citations

    5

    h-index

  4. ST
    Shuji Tanaka

    Tohoku University, Japan

    5 publications · 180 citations

    5

    h-index

  5. RT
    Roger T. Howe

    University of California, Berkeley, United States

    5 publications · 191 citations

    5

    h-index

1–5 of 1.2K

Institutions

260

  1. Tohoku University

    Sendai, Japan

    13 h-index

    80 publications

    2.7K citations

  2. University of Michigan

    Ann Arbor, United States

    13 h-index

    43 publications

    1.9K citations

  3. University of California, Berkeley

    Berkeley, United States

    12 h-index

    47 publications

    1.9K citations

  4. École Polytechnique Fédérale de Lausanne

    Lausanne, Switzerland

    10 h-index

    33 publications

    1.1K citations

  5. Georgia Institute of Technology

    Atlanta, United States

    8 h-index

    29 publications

    881 citations

  6. National Tsing Hua University

    Hsinchu, Taiwan

    7 h-index

    31 publications

    1.1K citations

  7. Analog Devices (United States)

    Norwood, United States

    7 h-index

    16 publications

    1.6K citations

  8. University of California, Los Angeles

    Los Angeles, United States

    6 h-index

    15 publications

    929 citations

1–8 of 260

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 27 publications · 1.3K citations

    19

    h-index

  2. Sensors and Actuators A Physical

    22 publications · 980 citations

    17

    h-index

  3. Journal of Microelectromechanical Systems

    19 publications · 819 citations

    15

    h-index

  4. 11

    h-index

  5. Microsystem Technologies

    6 publications · 144 citations

    6

    h-index

1–5