Concepedia

High-temperature Mems

High-Temperature MEMS is a class of microelectromechanical systems designed to operate reliably in elevated thermal environments, distinguished from conventional MEMS by their use of materials, fabrication processes, and structural designs that maintain functional integrity at temperatures significantly beyond typical silicon-based device limits.

110

Publications

5.4K

Citations

457

Authors

158

Institutions

Publications per year

2017–2026

22

Variants

High-temperature Microelectromechanical Systems

Parents

Publications

110

Silicon carbide MEMS for harsh environments

Mehran Mehregany, Christian A. Zorman, N. Rajan et al. · Proceedings of the IEEE · 1998 · 464 citations

, , +16

Review on materials, microsensors, systems and devices for high-temperature and harsh-environment applications

M. Werner, W.R. Fahrner · IEEE Transactions on Industrial Electronics · 2001 · 327 citations

, , +17

Single-chip surface micromachined integrated gyroscope with 50°/h Allan deviation

J.A. Geen, S. Sherman, John Chang et al. · IEEE Journal of Solid-State Circuits · 2002 · 273 citations

, , +16

Electromechanical Computing at 500°C with Silicon Carbide

Te-Hao Lee, Swarup Bhunia, Mehran Mehregany · Science · 2010 · 209 citations

, , +17

Millimeter-Scale, MEMS Gas Turbine Engines

Alan H. Epstein · 2003 · 171 citations

, , +17

1–5 of 110

Authors

457

  1. DJ
    Darrin J. Young

    Case Western Reserve University, United States

    5 publications · 109 citations

    5

    h-index

  2. JX
    Jijun Xiong

    North University of China, China

    4 publications · 129 citations

    4

    h-index

  3. WH
    Wen H. Ko

    Case Western Reserve University, United States

    4 publications · 87 citations

    4

    h-index

  4. GM
    Gerhard Müller

    Technical University of Munich, Germany

    3 publications · 150 citations

    3

    h-index

  5. MM
    M. Mihailovic

    Centre National de la Recherche Scientifique, France

    3 publications · 133 citations

    3

    h-index

1–5 of 457

Institutions

158

  1. Case Western Reserve University

    Cleveland, United States

    6 h-index

    19 publications

    2.8K citations

  2. Delft University of Technology

    Delft, The Netherlands

    4 h-index

    22 publications

    1.1K citations

  3. University of Michigan

    Ann Arbor, United States

    4 h-index

    19 publications

    702 citations

  4. North University of China

    Taiyuan, China

    4 h-index

    29 publications

    983 citations

  5. University of Cambridge

    Cambridge, United Kingdom

    3 h-index

    14 publications

    679 citations

  6. Chinese Academy of Sciences

    Beijing, China

    3 h-index

    11 publications

    278 citations

  7. Stanford University

    Stanford, United States

    3 h-index

    8 publications

    175 citations

  8. University of Brescia

    Brescia, Italy

    3 h-index

    8 publications

    258 citations

1–8 of 158

Venues

  1. Sensors and Actuators A Physical

    10 publications · 442 citations

    10

    h-index

  2. Journal of Micromechanics and Microengineering

    JMM · 8 publications · 403 citations

    8

    h-index

  3. Microsystem Technologies

    5 publications · 283 citations

    5

    h-index

  4. Journal of Microelectromechanical Systems

    5 publications · 186 citations

    5

    h-index

  5. Sensors

    4 publications · 175 citations

    4

    h-index

1–5