Concepedia

Demolding Mechanics

Demolding Mechanics is the mechanical analysis of the separation process between a nanostructured mold and a patterned resist, distinguishing itself by focusing on interfacial adhesion, material deformation, and residual stress effects during the release phase in nanoimprint lithography.

44

Publications

1.3K

Citations

140

Authors

54

Institutions

Publications per year

2017–2026

13

Parents

Publications

44

Study of the demolding process—implications for thermal stress, adhesion and friction control

Yuhua Guo, Gang Liu, Yin Xiong et al. · Journal of Micromechanics and Microengineering · 2006 · 104 citations

, , +13

Research on optimization of the hot embossing process

Yong He, Jianzhong Fu, Zichen Chen · Journal of Micromechanics and Microengineering · 2007 · 83 citations

, , +14

Analysis of the demolding forces during hot embossing

Yuhua Guo, Gang Liu, Xuelin Zhu et al. · Microsystem Technologies · 2006 · 64 citations

, , +5

Micro/nanofabrication of brittle hydrogels using 3D printed soft ultrafine fiber molds for damage-free demolding

Shang Lv, Jing Nie, Qing Gao et al. · Biofabrication · 2019 · 56 citations · Full text

, , +13

Surface adhesion and demolding force dependence on resist composition in ultraviolet nanoimprint lithography

Alborz Amirsadeghi, Jaejong Lee, Sunggook Park · Applied Surface Science · 2011 · 55 citations

, , +17

1–5 of 44

Authors

140

  1. JL
    Jaejong Lee

    Korea Institute of Machinery & Materials, South Korea

    7 publications · 219 citations

    7

    h-index

  2. SP
    Sunggook Park

    Louisiana State University, United States

    7 publications · 219 citations

    7

    h-index

  3. AA
    Alborz Amirsadeghi

    Louisiana State University, United States

    5 publications · 155 citations

    5

    h-index

  4. HK
    Hiroaki Kawata

    Osaka Prefecture University, Japan

    4 publications · 63 citations

    4

    h-index

  5. MY
    Masaaki Yasuda

    Osaka Prefecture University, Japan

    4 publications · 63 citations

    4

    h-index

1–5 of 140

Institutions

54

  1. Louisiana State University

    Baton Rouge, United States

    7 h-index

    22 publications

    649 citations

  2. Korea Institute of Machinery & Materials

    Daejeon, South Korea

    7 h-index

    7 publications

    219 citations

  3. Osaka Prefecture University

    Sakai, Japan

    4 h-index

    21 publications

    343 citations

  4. Nanyang Technological University

    Singapore, Singapore

    3 h-index

    10 publications

    242 citations

  5. Singapore Institute of Manufacturing Technology

    Singapore, Singapore

    3 h-index

    5 publications

    73 citations

  6. Massachusetts Institute of Technology

    Cambridge, United States

    3 h-index

    4 publications

    85 citations

  7. Centre National de la Recherche Scientifique

    Paris, France

    2 h-index

    3 publications

    84 citations

  8. Southern University of Science and Technology

    Shenzhen, China

    2 h-index

    8 publications

    164 citations

1–8 of 54

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 7 publications · 294 citations

    7

    h-index

  2. Microelectronic Engineering

    4 publications · 113 citations

    4

    h-index

  3. Microsystem Technologies

    4 publications · 149 citations

    4

    h-index

  4. Langmuir

    3 publications · 95 citations

    3

    h-index

  5. Japanese Journal of Applied Physics

    JJAP · 2 publications · 38 citations

    2

    h-index

1–5