J. Komori

A New TDDB Degradation Model Based on Cu Ion Drift in Cu Interconnect Dielectrics

N. Suzumura, S. Yamamoto, Daisuke Kodama et al. · 2006 · 106 citations

Electric Field Radice, Engineering, Charge Transport +17

Study of oxide breakdown under very low electric field

Akinobu Teramoto, Hiroshi Umeda, K. Azamawari et al. · 2003 · 28 citations

Electrical Engineering, Oxide Lifetime, Engineering +13

A wafer level monitoring method for plasma-charging damage using antenna PMOSFET test structure

Hitoshi Watanabe, J. Komori, K. Higashitani et al. · IEEE Transactions on Semiconductor Manufacturing · 1997 · 28 citations

Electrical Engineering, Engineering, High Voltage Engineering +11

A highly reliable selective CVD-W utilizing SiH4 reduction for VLSI contacts

H. Kotani, T. Tsutsumi, J. Komori et al. · 1987 · 18 citations

Electrical Engineering, Wafer Scale Processing, Engineering +13

Time-dependent dielectric breakdown of SiO2 films in a wide electric field range

Akinobu Teramoto, Hiroshi Umeda, K. Azamawari et al. · Microelectronics Reliability · 2001 · 17 citations

Electrical Engineering, Engineering, Oxide Electronics +8