A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels

Ruijie Xie, P. Montanini, Kerem Akarvardar, +84

EngineeringElectron-beam LithographyFinfet TechnologyMechanical EngineeringWafer Scale Processing +16

A 10nm platform technology for low power and high performance application featuring FINFET devices with multi workfunction gate stack on bulk and SOI

Kwangyou Seo, Bala Haran, Divya Gupta, +81

EngineeringVlsi DesignFinfet TechnologyIntegrated CircuitsWafer Scale Processing +16

High performance UTBB FDSOI devices featuring 20nm gate length for 14nm node and beyond

Qianlong Liu, M. Vinet, J. Gimbert, +36

Semiconductor TechnologyElectrical EngineeringGate LengthEngineeringVlsi Design +13

Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyond

Qijiong Liu, A. Yagishita, N. Loubet, +34

Low-power ElectronicsDevice ModelingElectrical EngineeringUtbb StructureEngineering +13

A 14 nm Embedded STT-MRAM CMOS Technology

D. Edelstein, Michael Rizzolo, Devika Sil, +38

Non-volatile MemoryEngineeringEmerging Memory TechnologyComputer ArchitectureMagnetism +14

UTBB FDSOI transistors with dual STI for a multi-V<inf>t</inf> strategy at 20nm node and below

L. Grenouillet, M. Vinet, J. Gimbert, +39

Electrical EngineeringUtbb Fdsoi TransistorsEngineeringVlsi DesignVlsi Architecture +9

Impact of back bias on ultra-thin body and BOX (UTBB) devices

Q. Liu, F. Monsieur, Arvind Kumar, +39

V BbElectrical EngineeringBiomedical SensorsEngineeringBack Bias +11

Strain engineered extremely thin SOI (ETSOI) for high-performance CMOS

A. Khakifirooz, Kangguo Cheng, Toshiharu Nagumo, +33

Semiconductor TechnologyElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Contact Strain +12

Air spacer for 10nm FinFET CMOS and beyond

Kangguo Cheng, C. Surisetty, Raja Muthinti, +14

Low-power ElectronicsElectrical EngineeringFinfet CmosEngineeringVlsi Design +12

A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology

S. Sankaran, S. Arai, R. Augur, +81

Materials ScienceMaterials EngineeringElectrical EngineeringBeol TechnologyEngineering +13