Thorsten Teutsch

Wafer level CSP using low cost electroless redistribution layer

Thorsten Teutsch, Thomas Oppert, E. Zakel et al. · 2002 · 24 citations

Engineering, Computer Engineering, Electrical Engineering +16

A roadmap to low cost flip chip and CSP using electroless Ni/Au

Thomas Oppert, E. Zakel, Thorsten Teutsch · 2002 · 22 citations

Engineering, Electrical Engineering, Manufacturing Engineering +12

Laser assisted soldering and Flip-Chip attach for 3-D packaging

Thomas Oppert, G. Azdasht, E. Zakel et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2006 · 20 citations

Engineering, Materials Engineering, Materials Science +14

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages

Matthias Fettke, Timo Kubsch, Andrej Kolbasow et al. · 2020 · 13 citations

Engineering, Materials Engineering, Materials Science +14

Low cost flip chip bumping

Thomas Oppert, Thorsten Teutsch, E. Zakel · 2002 · 12 citations

Engineering, Computer Engineering, Electrical Engineering +14