Concepedia

Timo Kubsch

TK

Statistics

Publications

3

Citations

34

H-Index

3

Active since

2019

Timo Kubsch is an author specializing in thermal load characterization, die-to-wafer bonding, and three-dimensional integration.

Publications per year

2019–2020

3

Publications

3

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages

Matthias Fettke, Timo Kubsch, Andrej Kolbasow et al. · 2020 · 13 citations

, , +14

A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Matthias Fettke, Andrej Kolbasow, Vinith Bejugam et al. · 2020 · 11 citations

, , +17

Vertical Laser Assisted Bonding for Advanced "3.5D" Chip Packaging

Andrej Kolbasow, Timo Kubsch, Matthias Fettke et al. · 2019 · 10 citations

, , +14

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