Concepedia

Thomas Oppert

TO

Statistics

Publications

7

Citations

125

H-Index

7

Active since

2002

Affiliations

Micro Systems Engineering (Germany)(Current)

Thomas Oppert is an author at Micro Systems Engineering (Germany) specializing in chip packaging, engineering, and semiconductor devices.

Publications per year

2002–2010

7

Publications

7

Solder ball bumper SB/sup 2/-a flexible manufacturing tool for 3-dimensional sensor and microsystem packages

P. Kasulke, Walter Schmidt, L. Titerle et al. · 2002 · 27 citations

Engineering, Manufacturing Engineering, Materials Engineering +9

Wafer level CSP using low cost electroless redistribution layer

Thorsten Teutsch, Thomas Oppert, E. Zakel et al. · 2002 · 24 citations

Engineering, Computer Engineering, Electrical Engineering +16

A roadmap to low cost flip chip and CSP using electroless Ni/Au

Thomas Oppert, E. Zakel, Thorsten Teutsch · 2002 · 22 citations

Engineering, Electrical Engineering, Manufacturing Engineering +12

Laser assisted soldering and Flip-Chip attach for 3-D packaging

Thomas Oppert, G. Azdasht, E. Zakel et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2006 · 20 citations

Engineering, Materials Engineering, Materials Science +14

Low cost flip chip bumping

Thomas Oppert, Thorsten Teutsch, E. Zakel · 2002 · 12 citations

Engineering, Computer Engineering, Electrical Engineering +14

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