Digital chemical vapor deposition and etching technologies for semiconductor processing

Y. Horiike, Tomoko Tanaka, Masatake Nakano, +6

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

EngineeringDigital EtchingSemiconductor ProcessingIntegrated CircuitsChemical Deposition +17

High Rate and Highly Selective SiO₂ Etching Employing Inductively Coupled Plasma

Takayuki Fukasawa, Akihiro Nakamura, Haruo Shindo, +1

Japanese Journal of Applied Physics

Materials ScienceSio 2Chemical EngineeringSaturation CurrentsEngineering +13

Young's Interference of Electrons in Field Emission Patterns

C. Oshima, K. Mastuda, Takayuki Kona, +6

Physical Review Letters

EngineeringPhysicsElectron SpectroscopyNanotechnologyNanoelectronics +10

Excimer-laser etching on silicon

Y. Horiike, N. Hayasaka, Makoto Sekine, +3

Applied Physics A

Materials ScienceEngineeringMicrofabricationApplied PhysicsLaser-assisted Deposition +3

Plasma applications for biochip technology

Takanori Ichiki, Yoshinari Sugiyama, Riko Taura, +2

Thin Solid Films

Electrical EngineeringPlasma ApplicationsInstrumentationNonthermal PlasmaPlasma Application +1

Fabrication of Quartz Microcapillary Electrophoresis Chips Using Plasma Etching

Takekazu Ujiie, Toshiaki Kikuchi, T. Ichiki, +1

Japanese Journal of Applied Physics

Materials ScienceElectrical EngineeringChemical EngineeringEngineeringCapillary Electrophoresis +11

Al Etching Characteristics Employing Helicon Wave Plasma

Nobuhiro Jiwari, Hiroaki Iwasawa, Akira Narai, +4

Japanese Journal of Applied Physics

Materials ScienceMaterials EngineeringCl IonsEngineeringPhysics +9

Measurement of Fluorocarbon Radicals Generated from C₄F₈/H₂ Inductively Coupled Plasma: Study on SiO₂ Selective Etching Kinetics

Kazuhiro Kubota, Hiroyuki Matsumoto, Haruo Shindo, +2

Japanese Journal of Applied Physics

EngineeringAppearance Mass SpectroscopyChemistryPlasma ProcessingChemical Engineering +16

RF Self-Bias Characteristics in Inductively Coupled Plasma

Takayuki Fukasawa, Tatuki Nouda, Akihiro Nakamura, +2

Japanese Journal of Applied Physics

Electron DensityElectrical EngineeringPlasma CharacteristicsEngineeringRadio Frequency +12

SiO₂ Etching Employing Inductively Coupled Plasma with Hot Inner Wall

Yasuhiko Chinzei, Takanori Ichiki, Ryo Kurosaki, +5

Japanese Journal of Applied Physics

Materials ScienceSio 2Chemical EngineeringElectrical EngineeringSelective Etching +13