John Yeh

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo et al. · 2012 · 125 citations

Engineering, Radio Frequency, Integrated Circuits +16

InFO_oS (Integrated Fan-Out on Substrate) Technology for Advanced Chiplet Integration

Yao Chiang, Shih-Peng Tai, John Yeh et al. · 2021 · 27 citations

Engineering, Device Integration, Computer Architecture +24

2nm Platform Technology Featuring Energy-Efficient Nanosheet Transistors and Interconnects Co-Optimized with 3DIC for AI, HPC and Mobile SoC Applications

Geoffrey Yeap, Shiwei Lin, Huiling Shang et al. · 2024 · 24 citations

A harmonic injection-locked frequency divider in 0.18-μm SiGe BiCMOS

Jun‐Chau Chien, Chin-Shen Lin, Liang-Hung Lu et al. · IEEE Microwave and Wireless Components Letters · 2006 · 23 citations

Positive Feedback, Engineering, Radio Frequency +8

A compact 35-65 GHz up-conversion mixer with integrated broadband transformers in 0.18-/spl mu/m SiGe BiCMOS technology

Ping-Chen Huang, Ren-Chieh Liu, Jeng‐Han Tsai et al. · 2006 · 20 citations

Power Consumption, Millimeter Wave Technology, Engineering +8