M. Haran - Concepedia

Author

M. Haran

Intel (United States)

Also Known As

M Haran, M. E. Haran, M. HARAN, M. Haran, M.E. Haran

Publications

1.2K

Citations

H-Index

Concepts

All Affiliations

Intel (United States)

About

M. Haran is an author at Intel (United States) specializing in engineering, electrical engineering, and computer engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	1.1K
2	Computer Engineering	5	5	1K
3	Electrical Engineering	5	5	1K
4	Applied Physics	3	3	908
5	Education	1	1	33

M. Haran

Publications

1.1K

Citations

H-Index

Page 1

	Year	Citations
A 14nm logic technology featuring 2<sup>nd</sup>-generation FinFET, air-gapped interconnects, self-aligned double patterning and a 0.0588 &#x00B5;m<sup>2</sup> SRAM cell size S. Natarajan, M. Agostinelli, Sheikh A. Akbar, -Generation FinfetRectangular FinsEngineeringVlsi DesignIntegrated Circuits	2014	521
A 10nm high performance and low-power CMOS technology featuring 3<sup>rd</sup> generation FinFET transistors, Self-Aligned Quad Patterning, contact over active gate and cobalt local interconnects C. Auth, A. Aliyarukunju, M. Asoro, EngineeringIntegrated CircuitsHigh PerformanceInterconnect (Integrated Circuits)High-speed Electronics	2017	353
Low-k interconnect stack with multi-layer air gap and tri-metal-insulator-metal capacitors for 14nm high volume manufacturing K. Fischer, M. Agostinelli, C. Allen, EngineeringVlsi DesignLogic ProductComputer ArchitectureInterconnect (Integrated Circuits)	2015	67
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing W. Hafez, Prashant Agnihotri, M. Asoro, EngineeringVlsi DesignEnergy EfficiencyFinfet ProcessComputer Architecture	2023	58
Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing B. Sell, Seungchan An, Jeffrey L. Armstrong, 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)	2022	40
Interconnect Stack using Self-Aligned Quad and Double Patterning for 10nm High Volume Manufacturing A. Yeoh, Advait Madhavan, Nicholas Kybert, Self-aligned QuadEngineeringComputer ArchitectureHigh VolumeInterconnect (Integrated Circuits)	2018	34
Angular Response of Piezoelectric Elements in Phased Array Ultrasound Scanners S.W. Smith, Olaf T. von Ramm, M. Haran, IEEE Transactions on Sonics and Ultrasonics Angular ResponseEngineeringPower UltrasoundPhased ArrayAcoustic Propagation	1979	33
Visualization and measurement of ultrasonic wavefronts M. Haran Proceedings of the IEEE Radiation ForceAeroacousticsEngineeringAerospace EngineeringMicroscopy	1979	27
HEXAGONAL MICROSTRIP PATCH ANTENNA FOR EARLY STAGE SKIN CANCER IDENTIFICATION M. Haran, Gaurav Kumar, A. Ferris Garvin, Telecommunications and Radio Engineering EngineeringSkin CancerPatch AntennaAntennaMicrowave Antenna	2020	16

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