T. Wang

3D stacking induced mechanical stress effects

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Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip

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Engineering, Computer Engineering, Heat Transfer +16

Effects of packaging on mechanical stress in 3D-ICs

Vladimir Cherman, Melina Lofrano, Veerle Simons et al. · 2015 · 12 citations · Full text

Natural Sciences, Computer Engineering, Materials Science +17