4
Publications
93
Citations
4
H-Index
2008
Active since
Poh Leng Eu is an author at NXP (Netherlands) specializing in engineering, mechanical engineering, and electronic packaging.
Top concepts
EngineeringMechanical EngineeringMechanicsMicrostructureSolid MechanicsMaterial ScienceFracture MechanicsMechanical BehaviorElectronic PackagingMechanics Of Materials
Publications per year
2008–2012
4
4
A study of crack propagation in Pb-free solder joints under drop impact
J.F.J.M. Caers, E.H. Wong, S.K.W. Seah et al. · 2008 · 24 citations
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1–4 of 4