Concepedia

Thorsten Meyer

TM

4

Publications

143

Citations

4

H-Index

2010

Active since

Affiliations

Intel (Germany)(Current)

STATS ChipPAC (Singapore)

STMicroelectronics (Singapore)

Infineon Technologies (Singapore)

Thorsten Meyer is an author at Intel (Germany) specializing in engineering, mechanical engineering, and computer engineering.

Top concepts

Publications per year

2010–2016

4

Publications

4

Next generation eWLB (embedded wafer level BGA) packaging

Yonggang Jin, Xavier Baraton, Seung Wook Yoon et al. · 2010 · 72 citations

Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging

Seung Wook Yoon, Yaojian Lin, Sharma Gaurav et al. · 2011 · 32 citations

, , +20

Determination of the material properties of polymers using laser-generated broadband ultrasound

Leander Claes, Thorsten Meyer, Fabian Bause et al. · Journal of sensors and sensor systems · 2016 · 24 citations · Full text

, , +19

Integrated MEMS oscillator for cellular transceivers

Greg Chance, Thorsten Meyer, Stephan Stoeckl et al. · 2014 · 15 citations

, , +10

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