K.-D. Lang

Statistics

Publications

Citations

306

H-Index

Active since

2000

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Swiss Center for Electronics and Microtechnology (Switzerland)

Tieto (Finland)

VTT Technical Research Centre of Finland

K.-D. Lang is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, materials science, and chip packaging.

Publications per year

2000–2018

Publications

Panel Level Packaging - A View Along the Process Chain

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 40 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +13

Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling

Kai Zoschke, Thorsten Fischer, Michael J. Topper et al. · 2012 · 34 citations

Engineering, Materials Engineering, Materials Science +15

Modelling the shape, length and radiation characteristics of bond wire antennas

Ivan Ndip, Abdurrahman Öz, Christian Tschoban et al. · IET Microwaves Antennas & Propagation · 2012 · 30 citations

Engineering, Electrical Engineering, Antennas +15

Surface oxide films on Aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness

Matthias Petzold, L. Berthold, D. S. Katzer et al. · Microelectronics Reliability · 2000 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +14

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2013 · 27 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

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