Charles-Alix Manier

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2013 · 27 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Benchmark of thin film coatings for lubricated slip-rolling contacts

Charles-Alix Manier, Géraldine Theiler, D. Spaltmann et al. · Wear · 2010 · 26 citations

Engineering, Materials Engineering, Materials Science +14

Zirconium-based coatings in highly stressed rolling contacts as alternative solution to DLC and ta-C coatings

Charles-Alix Manier, H. Ziegele, J. Barriga et al. · Wear · 2010 · 20 citations

Engineering, Materials Engineering, Materials Science +15

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$W RTC Mode and Programmable HF Clocks

David Ruffieux, Nicola Scolari, Frédéric Giroud et al. · IEEE Journal of Solid-State Circuits · 2013 · 20 citations

Engineering, Electrical Engineering, Microelectronics +14

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2015 · 17 citations

Engineering, Materials Science, Microelectromechanical Systems +16