Statistics
Publications
3
Citations
100
H-Index
3
Active since
2011
Affiliations
Jun Chul Kim is an author at Korea Advanced Institute of Science and Technology specializing in engineering, integrated circuit design, and microelectronics.
Publications per year
2011–2014
3
3
High-frequency through-silicon Via (TSV) failure analysis
Joohee Kim, Jonghyun Cho, Jun So Pak et al. · 2011 · 17 citations
Engineering, Computer Engineering, Electrical Engineering +15
Frequency and time domain measurement of through-silicon via (TSV) failure
D. Jung, Joohee Kim, Heegon Kim et al. · 2012 · 12 citations
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