Concepedia

Byung-Gil Jeong

BJ

Statistics

Publications

4

Citations

76

H-Index

4

Active since

2006

Affiliations

Samsung (South Korea)(Current)

Byung-Gil Jeong is an author at Samsung (South Korea) specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsApplied PhysicsMicrofabricationElectronic PackagingMicrostructureMaterial ScienceAdvanced PackagingMaterials EngineeringElectrical Engineering

Publications per year

2006–2013

4

Publications

4

Performance and reliability of new CMUT design with improved efficiency

Byung-Gil Jeong, Dongkyun Kim, Seogwoo Hong et al. · Sensors and Actuators A Physical · 2013 · 29 citations

Electrical Engineering, Engineering, Mechatronics +4

Wafer-level low temperature bonding with Au-In system

Yoonchul Sohn, Qian Wang, Suk-Jin Ham et al. · 2007 · 23 citations

Materials Science, Materials Engineering, Advanced Packaging +15

Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Applications

Suk-Jin Ham, Byung-Gil Jeong, Ji-Hyuk Lim et al. · 2007 · 14 citations

Nano-liter Cavity, Engineering, Wafer-level Packaging +20

Low Temperature, Wafer Level Au-In Bonding for ISM Packaging

Qian Wang, Kyu-Dong Jung, Minseog Choi et al. · 2006 · 10 citations

Materials Science, Advanced Packaging, Chip-scale Package +15

Rows per page

1–4 of 4