Concepedia

Ji-Hyuk Lim

JL

Statistics

Publications

2

Citations

26

H-Index

2

Active since

2005

Affiliations

Samsung (South Korea)(Current)

Ji-Hyuk Lim is an author at Samsung (South Korea) specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanical Engineering3D PrintingHeat TransferApplied PhysicsNanoelectronicsMicroelectronicsMicrofabricationThermal Engineering

Publications per year

2005–2007

2

Publications

2

Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Applications

Suk-Jin Ham, Byung-Gil Jeong, Ji-Hyuk Lim et al. · 2007 · 14 citations

Nano-liter Cavity, Engineering, Wafer-level Packaging +20

Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation

Ji-Hyuk Lim, Keon Kuk, Seung-Joo Shin et al. · Microelectronics Reliability · 2005 · 12 citations

Engineering, Mechanical Engineering, Numerical Simulation +7

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