C. H. Ting - Concepedia

Author

C. H. Ting

Intel (United States)

Also Known As

C. H. TING, C. H. Ting, C. TING, C. Ting, C.H. Ting, Chiu H. Ting, Chiu Ting, Chu-Chi Ting

Publications

1.3K

Citations

H-Index

Concepts

All Affiliations

Intel (United States)IBM (United States)University of California, Berkeley Stanford University

About

C. H. Ting is an author at Intel (United States) specializing in engineering, applied physics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	17	1.2K
2	Applied Physics	12	13	992
3	Chemical Engineering	3	3	279
4	Natural Sciences	1	1	177
5	Chemistry	1	1	42

C. H. Ting

Publications

1.2K

Citations

H-Index

Page 1

	Year	Citations
Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration Valery M. Dubin, Yosi Shacham‐Diamand, Bin Zhao, Journal of The Electrochemical Society EngineeringElectroless Cu ThermodynamicsChemical DepositionUltralarge Scale IntegrationElectrometallurgy	1997	197
Monte Carlo simulation of fast secondary electron production in electron beam resists Kenji Murata, David F. Kyser, C. H. Ting Journal of Applied Physics Electrical EngineeringEngineeringElectron-beam LithographyPhysicsElectron Spectroscopy	1981	177
Selective electroless copper for VLSI interconnection P.-L. Pai, C. H. Ting IEEE Electron Device Letters Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringVlsi Design	1989	176
Selective Electroless Metal Deposition for Integrated Circuit Fabrication C. H. Ting, Milan Paunović Journal of The Electrochemical Society EngineeringIntegrated CircuitsChemical DepositionContact FillingSurface Technology	1989	91
Electron-beam resist edge profile simulation A. R. Neureuther, David F. Kyser, C. H. Ting IEEE Transactions on Electron Devices Electrical EngineeringEngineeringPmma ResistElectron-beam LithographyBeam Lithography	1979	82
Methods And Needs For Low K Material Research C. H. Ting, Thomas E. Seidel MRS Proceedings Materials EngineeringRelated MaterialMaterials ScienceEngineeringMaterial Selection	1995	77
Selective Electroless Metal Deposition for Via Hole Filling in VLSI Multilevel Interconnection Structures C. H. Ting, Milan Paunović, P.-L. Pai, Journal of The Electrochemical Society EngineeringChemical DepositionSurface TechnologyChemical EngineeringWafer Scale Processing	1989	72
Modeling ion milling A. R. Neureuther, C. Y. Liu, C. H. Ting Journal of Vacuum Science and Technology Algorithm AssumptionsElectrical EngineeringEngineeringIndustrial EngineeringMicrofabrication	1979	58
Time-Dependence of Zinc Diffusion in Gallium Arsenide under a Concentration Gradient C. H. Ting, G. L. Pearson Journal of The Electrochemical Society Concentration GradientEffective Diffusion CoefficientEngineeringDiffusion ResistanceDiffusion Profiles	1971	42
Material Characteristics of Spin‐On Glasses for Interlayer Dielectric Applications Pei‐Lin Pai, Arun Chetty, Robert Roat, Journal of The Electrochemical Society Materials ScienceDielectric PropertiesGlass-ceramicInterlayer Dielectric ApplicationsEngineering	1987	39

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