P.-L. Pai

Selective electroless copper for VLSI interconnection

P.-L. Pai, C. H. Ting · IEEE Electron Device Letters · 1989 · 176 citations

Materials Science, Electrical Engineering, Electromigration Technique +15

Selective Electroless Metal Deposition for Via Hole Filling in VLSI Multilevel Interconnection Structures

C. H. Ting, Milan Paunović, P.-L. Pai et al. · Journal of The Electrochemical Society · 1989 · 72 citations

Engineering, Chemical Deposition, Surface Technology +22

Copper as the future interconnection material

P.-L. Pai, C. H. Ting · 2003 · 34 citations

Engineering, Future Interconnection, Cu Film +18

MEMS-based hemispherical resonator gyroscopes

P.-L. Pai, Faisal K. Chowdhury, Carlos H. Mastrangelo et al. · 2012 · 24 citations

Aeroacoustics, Engineering, Micromachines +12

Random soft error suppression by stoichiometric engineering: CMOS compatible and reliable 1Mb HfO<inf>2</inf>-ReRAM with 2 extra masks for embedded IoT systems

ChiaHua Ho, Tianjun Shen, Peter Hsu et al. · 2016 · 17 citations

Engineering, Embedded Systems, Signal Integrity +17