Franz-Josef Schmückle

Crosstalk Corrections for Coplanar-Waveguide Scattering-Parameter Calibrations

Dylan F. Williams, Franz-Josef Schmückle, Ralf Doerner et al. · IEEE Transactions on Microwave Theory and Techniques · 2014 · 62 citations

Photonics, Crosstalk Corrections, Engineering +13

Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Kai Zoschke, M. J. Wolf, Michael J. Topper et al. · IEEE Transactions on Advanced Packaging · 2007 · 56 citations

Flip Chip, Integrated Passive Devices, Electrical Engineering +12

SciFab -a wafer-level heterointegrated InP DHBT/SiGe BiCMOS foundry process for mm-wave applications

Nils Weimann, D. Stoppel, Muhammed Ihab Schukfeh et al. · physica status solidi (a) · 2016 · 41 citations · Full text

Optical Materials, Engineering, Inp Dhbt +19

Connecting Chips With More Than 100 GHz Bandwidth

W. Heinrich, Maruf Hossain, Siddhartha Sinha et al. · IEEE Journal of Microwaves · 2021 · 41 citations · Full text

Electrical Engineering, Chip-scale Package, Engineering +15

Flip-Chip Approach for 500 GHz Broadband Interconnects

Siddhartha Sinha, Ralf Doerner, Franz-Josef Schmückle et al. · IEEE Transactions on Microwave Theory and Techniques · 2017 · 28 citations

Engineering, Microwave Transmission, Integrated Circuits +16