Franz-Josef Schmückle

Author

Ferdinand-Braun-Institut

Also Known As

F.J. Schmückle, Franz-Josef Schmuckle, Franz-Josef Schmückle

Publications

360

Citations

H-Index

Concepts

All Affiliations

Ferdinand-Braun-Institut IMEC Brandenburg University of Technology Cottbus-Senftenberg Physikalisch-Technische Bundesanstalt Infineon Technologies (Germany)

About

Franz-Josef Schmückle is an author at Ferdinand-Braun-Institut specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	338
2	Electrical Engineering	10	10	276
3	Computer Engineering	6	6	223
4	Applied Physics	5	5	121
5	Education	2	2	80

Franz-Josef Schmückle

Publications

338

Citations

H-Index

Page 1

	Year	Citations
Crosstalk Corrections for Coplanar-Waveguide Scattering-Parameter Calibrations Dylan F. Williams, Franz-Josef Schmückle, Ralf Doerner, IEEE Transactions on Microwave Theory and Techniques PhotonicsCrosstalk CorrectionsEngineeringPhysicsMeasurement	2014	62
Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies Kai Zoschke, M. J. Wolf, Michael J. Topper, IEEE Transactions on Advanced Packaging Flip ChipIntegrated Passive DevicesElectrical EngineeringChip-scale PackageEngineering	2007	56
SciFab -a wafer-level heterointegrated InP DHBT/SiGe BiCMOS foundry process for mm-wave applications Nils Weimann, D. Stoppel, Muhammed Ihab Schukfeh, physica status solidi (a) Optical MaterialsEngineeringInp DhbtWafer Scale ProcessingRf Semiconductor	2016	41
Connecting Chips With More Than 100 GHz Bandwidth W. Heinrich, Maruf Hossain, Siddhartha Sinha, IEEE Journal of Microwaves Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)High-frequency Device	2021	41
Flip-Chip Approach for 500 GHz Broadband Interconnects Siddhartha Sinha, Ralf Doerner, Franz-Josef Schmückle, IEEE Transactions on Microwave Theory and Techniques EngineeringMicrowave TransmissionIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility	2017	28
Coplanar Ka-band SiGe-MMIC amplifier K.M. Strohm, J.-F. Luy�, F. Schäffler, Electronics Letters Electrical EngineeringEngineeringRf SemiconductorHigh-frequency DeviceElectronic Engineering	1995	25
Multifinger Indium Phosphide Double-Heterostructure Transistor Circuit Technology With Integrated Diamond Heat Sink Layer Ksenia Nosaeva, Thualfiqar Al-Sawaf, W. John, IEEE Transactions on Electron Devices Electrical EngineeringElectronic DevicesEngineeringRf SemiconductorTerahertz Indium	2016	19
Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies Nils Weimann, Sirinpa Monayakul, Siddhartha Sinha, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringComputer ArchitectureIntegrated Circuits300–500-Ghz AssembliesInterconnect (Integrated Circuits)	2017	18
Establishing traceability for on-wafer S-parameter measurements of membrane technology devices up to 110 GHz Uwe Arz, Sherko Zinal, T. Probst, EngineeringMembrane Technology DevicesMeasurementOn-wafer S-parameter MeasurementsEducation	2017	18
On-wafer small-signal and large-signal measurements up to sub-THz frequencies Viktor Krozer, Ralf Doerner, Franz-Josef Schmückle, Thz PhotonicsElectrical EngineeringEngineeringRf SemiconductorSub-thz Frequencies	2014	15

Page 1