T.S. Cale

Von Mises Stress in Chemical‐Mechanical Polishing Processes

Duo Wang, J. Lee, Karey Holland et al. · Journal of The Electrochemical Society · 1997 · 171 citations

Von Mises Stress, Engineering, Mechanical Engineering +16

A unified line-of-sight model of deposition in rectangular trenches

T.S. Cale, Gregory B. Raupp · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1990 · 125 citations

Engineering, Free Molecular Flow, Fluid Mechanics +22

Stress distribution in chemical mechanical polishing

C Srinivasa-Murthy, D Wang, Stephen P. Beaudoin et al. · Thin Solid Films · 1997 · 105 citations

Materials Science, Stress Distribution, Engineering +7

Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration

Frank Niklaus, Ravi Kumar, J. J. McMahon et al. · Journal of The Electrochemical Society · 2006 · 80 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Free molecular transport and deposition in long rectangular trenches

T.S. Cale, Gregory B. Raupp, T. H. Gandy · Journal of Applied Physics · 1990 · 59 citations

Engineering, Free Molecular Flow, Long Rectangular Trenches +16