T.S. Cale - Concepedia

Author

T.S. Cale

Arizona State University

Also Known As

T CALE, T. Cale, T. S Cale, T. S. Cale, T.S Cale, T.S. CALE, T.S. Cale, T. S. Cale, Tim S. Cale

100

Publications

1.6K

Citations

H-Index

Concepts

All Affiliations

Arizona State University Rensselaer Polytechnic Institute Motorola (United States)University at Albany, State University of New York University of Houston

About

T.S. Cale is an author at Arizona State University specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	21	34	1.3K
2	Applied Physics	19	23	823
3	Natural Sciences	2	2	137
4	Education	1	1	48
5	Biomedical Engineering	1	1	40

T.S. Cale

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
Von Mises Stress in Chemical‐Mechanical Polishing Processes Duo Wang, J. Lee, Karey Holland, Journal of The Electrochemical Society Von Mises StressEngineeringMechanical EngineeringSurface IntegrityResidual Stress	1997	171
A unified line-of-sight model of deposition in rectangular trenches T.S. Cale, Gregory B. Raupp Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena EngineeringFree Molecular FlowFluid MechanicsComputer-aided DesignChemical Deposition	1990	125
Stress distribution in chemical mechanical polishing C Srinivasa-Murthy, D Wang, Stephen P. Beaudoin, Thin Solid Films Materials ScienceStress DistributionEngineeringMaterial ProcessingMechanical Engineering	1997	105
Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration Frank Niklaus, Ravi Kumar, J. J. McMahon, Journal of The Electrochemical Society EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2006	80
Free molecular transport and deposition in long rectangular trenches T.S. Cale, Gregory B. Raupp, T. H. Gandy Journal of Applied Physics EngineeringFree Molecular FlowLong Rectangular TrenchesChemical DepositionIntegral Equations	1990	59
Free molecular transport and deposition in cylindrical features T.S. Cale, Gregory B. Raupp Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena Clausing-like Integral EquationMolecular SolidEngineeringFluid PropertiesInitial Deposition Profiles	1990	57
Step coverage prediction in low-pressure chemical vapor deposition Gregory B. Raupp, T.S. Cale Chemistry of Materials Quantitative MethodsEngineeringOccupational Health SciencesDatabasesAltmetric Attention Score	1989	48
Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs Jian‐Qiang Lu, Anurag Jindal, Yongchai Kwon, EngineeringEvaluation ProceduresInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2004	40
Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives R.J. Gutmann, Jian-Qiang Lü, Yongchai Kwon, EngineeringMechanical EngineeringNew Polymeric AdhesivesBiomedical EngineeringWafer Scale Processing	2002	40
Flux distributions in low pressure deposition and etch models T.S. Cale Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Low Pressure DepositionEngineeringPhysicsNumerical SimulationApplied Physics	1991	36

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