S. Mongeon

Self-aligned metal capping layers for copper interconnects using electroless plating

Jeff Gambino, Jean Wynne, J. Gill et al. · Microelectronic Engineering · 2006 · 64 citations

Engineering, Materials Engineering, Materials Science +16

Critical ultra low-k TDDB reliability issues for advanced CMOS technologies

F. Chen, M. Shinosky, B. Li et al. · 2009 · 27 citations

Engineering, Electrical Engineering, Electronic Materials +16

CMOS Imager with Copper Wiring and Lightpipe

Jeff Gambino, B. Leidy, J. Adkisson et al. · 2006 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Initial Stages of Growth of Heteroepitaxial Yttria-Stabilized Zirconia Films on Silicon Substrates

Patricia S. Bunt, W. J. Varhue, Ellen Adams et al. · Journal of The Electrochemical Society · 2000 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +17

Stress Migration Lifetime for Cu Interconnects With CoWP-Only Cap

J. Gambino, C.L. Johnson, Joe Therrien et al. · IEEE Transactions on Device and Materials Reliability · 2006 · 11 citations

Engineering, Materials Engineering, Materials Science +11