Jean Wynne

Self-aligned metal capping layers for copper interconnects using electroless plating

Jeff Gambino, Jean Wynne, J. Gill et al. · Microelectronic Engineering · 2006 · 64 citations

Materials Science, Electrical Engineering, Self-aligned Metal +8

CMOS Imager with Copper Wiring and Lightpipe

Jeff Gambino, B. Leidy, J. Adkisson et al. · 2006 · 17 citations

Engineering, Micro-optical Component, Image Sensor +16

Prototype of multi-stacked memory wafers using low-temperature oxide bonding and ultra-fine-dimension copper through-silicon via interconnects

Wei‐Hung Lin, Johnathan Faltermeier, Kevin Winstel et al. · 2014 · 11 citations

Engineering, Computer Architecture, Itrs Roadmap +16

Stress Migration Lifetime for Cu Interconnects With CoWP-Only Cap

J. Gambino, C.L. Johnson, Joe Therrien et al. · IEEE Transactions on Device and Materials Reliability · 2006 · 11 citations

Materials Science, Electrical Engineering, Electromigration Technique +13