1
Publications
22
Citations
1
H-Index
2010
Active since
Affiliations
Huan-Chun Fu is an author at Industrial Technology Research Institute specializing in applied physics, 3d printing, and mechanical engineering.
Top concepts
3D PrintingEngineering3D IntegrationApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationAdvanced PackagingElectronic PackagingMechanical Engineering
Publications per year
2010–2010
1
1
Wafer-to-wafer hybrid bonding technology for 3D IC
Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu et al. · 2010 · 22 citations
Engineering, Mechanical Engineering, Wafer Scale Processing +16
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