Julius Burggraf

Integration of a temporary carrier in a TSV process flow

Jean Charbonnier, S. Chéramy, David Henry et al. · 2009 · 61 citations

Engineering, Electrical Engineering, Materials Science +17

Facilitating Ultrathin Wafer Handling for TSV Processing

A. Jouve, Shelly Fowler, Mark Privett et al. · 2008 · 42 citations

Engineering, Materials Engineering, Materials Science +17

Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding

W. H. Teh, Claire Deeb, Julius Burggraf et al. · 2010 · 10 citations

Engineering, Materials Engineering, Materials Science +13