Wen Qiu

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Active since

2012

Affiliations

Advanced Micro Devices (United States)(Current)

Wen Qiu is an author at Advanced Micro Devices (United States) specializing in semiconductor reliability, semiconductor devices, and failure analysis.

Publications per year

2012–2018

Publications

High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

Syahirah Zulkifli, Bemice Zee, Wen Qiu et al. · 2017 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

Non-Destructive 3D Failure Analysis Work Flow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy

Antonio Orozco, E. Talanova, Alex Jeffers et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2018 · 13 citations

Arts, Manufacturing Engineering, 3D Modeling +12

Lock-in Thermography for Flip-Chip Package Failure Analysis

Lihong Cao, Manasa Venkata, Jeffery Huynh et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2012 · 12 citations

Engineering, Computer Engineering, Packaging Design +16

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