T. Remmel

Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies

P. Zürcher, P. Alluri, Peir-Yung Chu et al. · 2002 · 62 citations

Materials Science, Electrical Engineering, Sheet Resistance +14

Ohmic contact penetration and encroachment in GaAs/AlGaAs and GaAs FETs

H. Goronkin, S. Tehrani, T. Remmel et al. · IEEE Transactions on Electron Devices · 1989 · 44 citations

Materials Science, Aluminium Nitride, Electrical Engineering +11

Leakage behavior and reliability assessment of tantalum oxide dielectric MIM capacitors

T. Remmel, Rampi Ramprasad, James Walls · 2003 · 38 citations

Electrical Engineering, Leakage Behavior, Engineering +9

Progression of damage caused by temperature cycling on a large die in a molded plastic package

I. A. Lesk, R. Thomas, G. W. Hawkins et al. · 2002 · 19 citations

Engineering, Large Silicon Chips, Mechanical Engineering +26

Application of on-chip MIM decoupling capacitor for 90nm SOI microprocessor

D. Roberts, Walter Johnstone, H. Sanchez et al. · 2006 · 17 citations

Low-power Electronics, System On Chip, Electrical Engineering +12