Z.L. Li

Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Hongyun Zhao, J.H. Liu, Z.L. Li et al. · Materials Letters · 2016 · 67 citations

Natural Sciences, Materials Engineering, Materials Science +13

Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process

Z.L. Li, Hanhai Dong, Xiaoguo Song et al. · Ultrasonics Sonochemistry · 2017 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +11

Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures

Huijuan Dong, Z.L. Li, Xiaoguo Song et al. · Materials Science and Engineering A · 2017 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +17

Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering

J.H. Liu, Hongyun Zhao, Z.L. Li et al. · Journal of Alloys and Compounds · 2016 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +15

Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Z.L. Li, Hanhai Dong, Xiaoguo Song et al. · Ultrasonics Sonochemistry · 2016 · 39 citations

Engineering, Materials Engineering, Materials Science +10