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Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Materials EngineeringMaterials ScienceRapid FormationEngineeringDie AttachmentMechanical EngineeringApplied PhysicsStructural CeramicMicroelectronicsCarbideNi3sn4 Joints