Hanhai Dong

Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Hongyun Zhao, J.H. Liu, Z.L. Li et al. · Materials Letters · 2016 · 64 citations

Materials Engineering, Materials Science, Engineering +9

Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process

Z.L. Li, Hanhai Dong, Xiaoguo Song et al. · Ultrasonics Sonochemistry · 2017 · 44 citations

Materials Engineering, Materials Science, Friction Welding +7

Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Z.L. Li, Hanhai Dong, Xiaoguo Song et al. · Ultrasonics Sonochemistry · 2016 · 38 citations

Materials Engineering, Materials Science, Rapid Formation +8

2D material/epoxy composite coatings, a perspective from the regulation of 2D materials

Hanhai Dong, Yixuan Qiao, Peng Song et al. · Progress in Organic Coatings · 2023 · 35 citations

Materials Engineering, Materials Science, Engineering +7

Influence of Ni particle addition on grain refinement of Cu-Sn intermetallic compound joints bonded at various temperatures

Xiangmin Guo, Z.L. Li, Xiaoguo Song et al. · Journal of Alloys and Compounds · 2018 · 30 citations

Materials Science, Materials Engineering, Various Temperatures +9