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Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process

Materials EngineeringMaterials ScienceFriction WeldingEngineeringApplied PhysicsAsymmetrical Ni/sn/cu SystemMetallurgical InteractionIntermetallic Compound JointsMicrostructureMetal Processing