Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process - Concepedia

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Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

64

Citations

11

References

2016

Year

Hongyun Zhao, J.H. Liu, Z.L. Li, Y. X. Zhao, Hongwei Niu, Xiaoguo Song, Hanhai Dong

Materials Letters

Materials EngineeringMaterials ScienceEngineeringPowder MetallurgyCorrosionApplied PhysicsMetallurgical InteractionCu/sn/cu JointsMetallurgical ProcessNon-interfacial GrowthMicrostructureMetal Processing

References

	Year	Citations

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