Statistics
Publications
5
Citations
140
H-Index
5
Active since
1998
Affiliations
Nitto (Japan)(Current)
A. Prabhu is an author at Nitto (Japan) specializing in engineering, packaging engineering, and materials engineering.
Publications per year
1998–2006
5
5
High reliability LTCC BGA for telecom applications
A. Prabhu, W. Schaefer, S.A. Patil · 2002 · 19 citations
Wafer level Chip Scale packaging : Solder joint reliability
Luu Nguyen, N. Kelkar, T. Kao et al. · 1998 · 18 citations
A novel flip chip technology using non-conductive resin sheet
Shinya Ito, Masaki Mizutani, H. Noro et al. · 2002 · 14 citations
Engineering, Materials Engineering, Microelectromechanical Systems +14
Study of encapsulating system for diversified area bump packages
Shinya Ito, M. Kuwamura, S. Sudo et al. · 2002 · 13 citations
Engineering, Computer Engineering, Electrical Engineering +14
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