Concepedia

Author

M. Kuwamura

Nitto (Japan)

Also Known As

M. Kuwamura

10

Publications

64

Citations

4

H-Index

16

Concepts

All Affiliations

Nitto (Japan)Nitto (United States)
MK

About

M. Kuwamura is an author at Nitto (Japan) specializing in electronic packaging, engineering, and materials science.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

4

4

50

2

Materials Engineering

2

2

23

3

Computer Engineering

1

1

13

4

Electrical Engineering

1

1

13

5

Logistics

1

1

13

M. Kuwamura

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4

Publications

50

Citations

4

H-Index

YearCitations

A novel flip chip technology using non-conductive resin sheet

Shinya Ito, Masaki Mizutani, H. Noro,

2002

14

Special characteristic of future flip chip underfill materials and the process

Hiroyuki Usui, Masaki Mizutani, H. Noro,

2002

13

Study of encapsulating system for diversified area bump packages

Shinya Ito, M. Kuwamura, S. Sudo,

2002

13

Solid type cavity fill and under fill materials for new IC packaging applications

Shinya Ito, M. Kuwamura, S. Akizuki,

2002

10

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