Statistics
Publications
4
Citations
50
H-Index
4
Active since
2002
Affiliations
Nitto (Japan)(Current)
M. Kuwamura is an author at Nitto (Japan) specializing in electronic packaging, engineering, and materials science.
Publications per year
2002–2002
4
4
A novel flip chip technology using non-conductive resin sheet
Shinya Ito, Masaki Mizutani, H. Noro et al. · 2002 · 14 citations
Special characteristic of future flip chip underfill materials and the process
Hiroyuki Usui, Masaki Mizutani, H. Noro et al. · 2002 · 13 citations
Study of encapsulating system for diversified area bump packages
Shinya Ito, M. Kuwamura, S. Sudo et al. · 2002 · 13 citations
Engineering, Advanced Packaging (Semiconductors), Logistics +18
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