Arthur Sherman

Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers

S. M. Rossnagel, Arthur Sherman, Frederick T. Turner · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 166 citations

Materials Science, Surface Technology, Interconnect Diffusion Barriers +13

Growth and Properties of LPCVD Titanium Nitride as a Diffusion Barrier for Silicon Device Technology

Arthur Sherman · Journal of The Electrochemical Society · 1990 · 128 citations

Engineering, Thin Film Process Technology, Chemical Deposition +20

Plasma-assisted chemical vapor deposition processes and their semiconductor applications

Arthur Sherman · Thin Solid Films · 1984 · 43 citations

Chemical Engineering, Plasma Electronics, Engineering +4

Modeling of chemical vapor deposition reactors

Arthur Sherman · Journal of Electronic Materials · 1988 · 24 citations

Process Design, Chemical Engineering, Engineering +5

<i>I</i> <i>n</i> <i>s</i> <i>i</i> <i>t</i> <i>u</i> removal of native oxide from silicon wafers

Arthur Sherman · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1990 · 11 citations

Engineering, Native Oxide, Integrated Circuits +19