Kevin M. Brunson

Cost-effective and manufacturable route to the fabrication of high-density 2D micromachined ultrasonic transducer arrays and (CMOS) signal conditioning electronics on the same silicon substrate

R.A. Noble, Ryan R. Davies, Mike Day et al. · 2002 · 43 citations

Engineering, Biomedical Engineering, Electrical Engineering +16

Separation of two distinct fast interface state contributions at the (100)Si/SiO2 interface using the conductance technique

Michael J. Uren, Kevin M. Brunson, Andrèa M. Hodge · Applied Physics Letters · 1992 · 36 citations

Engineering, Materials Engineering, Materials Science +17

Measurement of buried oxide thermal conductivity for accurate electrothermal simulation of SOI device

B.M. Tenbroek, R.J.T. Bunyan, Gregory L. Whiting et al. · IEEE Transactions on Electron Devices · 1999 · 30 citations

Engineering, Electrical Engineering, Materials Science +17

Measured intrinsic defect density throughout the entire band gap at the <100> Si/SiO₂interface

David Sands, Kevin M. Brunson, Mohammed H. Tayarani-Najaran · Semiconductor Science and Technology · 1992 · 27 citations

Natural Sciences, Materials Science, Physics +17

Effect of deposition process on the thin-film ZnS/<i>p</i>-Si interface

David Sands, Kevin M. Brunson, C.B. Thomas et al. · Applied Physics Letters · 1987 · 26 citations

Engineering, Materials Engineering, Materials Science +17