Kuo‐Chin Chang

Statistics

Publications

Citations

140

H-Index

Active since

1988

Affiliations

Taiwan Semiconductor Manufacturing Company (United States)(Current)

Auburn University

Taiwan Semiconductor Manufacturing Company (Taiwan)

Kuo‐Chin Chang is an author at Taiwan Semiconductor Manufacturing Company (United States) specializing in chip packaging, materials engineering, and materials science.

ORCID

Publications per year

1988–2023

Publications

A rule-based software test data generator

W.H. Deason, David B. Brown, Kuo‐Chin Chang et al. · IEEE Transactions on Knowledge and Data Engineering · 1991 · 51 citations

Computing, Computer Science, Programming Languages +12

Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package

Kuo‐Chin Chang, Yuan Li, Chung-Yi Lin et al. · 2004 · 24 citations

Engineering, Electrical Engineering, Materials Engineering +15

Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad

Kuo‐Chin Chang, Kuo‐Ning Chiang · Journal of Electronic Materials · 2004 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +16

Optimization of board-level thermomechanical reliability of high performance flip-chip package assembly

Tong Hong Wang, Ching-Chun Wang, Yi‐Shao Lai et al. · Microelectronic Engineering · 2008 · 14 citations

Engineering, Computer Engineering, Mechanical Engineering +14

A planning model with problem analysis and operator hierarchy

Kuo‐Chin Chang, William G. Wee · IEEE Transactions on Pattern Analysis and Machine Intelligence · 1988 · 13 citations

Management, Industrial Engineering, Optimization +14

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