Ching‐Fa Yeh

Modeling of the Wear Mechanism during Chemical‐Mechanical Polishing

Chi‐Wen Liu, Bau‐Tong Dai, Wei‐Tsu Tseng et al. · Journal of The Electrochemical Society · 1996 · 100 citations

Natural Sciences, Materials Engineering, Materials Science +17

Post-Cu CMP cleaning for colloidal silica abrasive removal

Po‐Lin Chen, Jyh‐Herng Chen, Ming‐Shih Tsai et al. · Microelectronic Engineering · 2004 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +13

Influence of measuring environment on the electrical characteristics of pentacene-based thin film transistors

Yu‐Wu Wang, Yi‐Kai Wang, Yi‐Kai Wang et al. · Thin Solid Films · 2004 · 38 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Novel post CMP cleaning using buffered HF solution and ozone water

Ching‐Fa Yeh, Chih‐Wen Hsiao, Wen-Shan Lee · Applied Surface Science · 2003 · 38 citations

Engineering, Chemical Engineering, Water Treatment +11

Performance and off-state current mechanisms of low-temperature processed polysilicon thin-film transistors with liquid phase deposited SiO/sub 2/ gate insulator

Ching‐Fa Yeh, Shyue‐Shyh Lin, Tzung-Zu Yang et al. · IEEE Transactions on Electron Devices · 1994 · 38 citations

Engineering, Electrical Engineering, Materials Science +17