Concepedia

Jingru Dai

JD

7

Publications

208

Citations

7

H-Index

2013

Active since

Affiliations

University of Nottingham(Current)

Jingru Dai is an author at University of Nottingham specializing in microelectronics, electrical engineering, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringPower ElectronicsSinteringReliabilityMicrostructureApplied PhysicsMaterial Science

Publications per year

2013–2024

7

Publications

7

Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling

Jingru Dai, Jianfeng Li, Pearl Agyakwa et al. · IEEE Transactions on Device and Materials Reliability · 2018 · 57 citations · Full text

Materials Science, Advanced Packaging, Electrical Engineering +14

Electrical Performance and Reliability Characterization of a SiC MOSFET Power Module With Embedded Decoupling Capacitors

Li Yang, Ke Li, Jingru Dai et al. · IEEE Transactions on Power Electronics · 2018 · 47 citations · Full text

Engineering, Electrical Performance, Power Electronic Systems +16

A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage

Fei Qin, Xiaorui Bie, Tong An et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2020 · 47 citations

Engineering, Igbt Modules, Power Electronics +16

Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling

Pearl Agyakwa, Stuart Robertson, Jingru Dai et al. · Journal of Electronic Materials · 2024 · 16 citations · Full text

Grain refining of Er added to Ti–22Al–25Nb alloy and morphology of erbium precipitates

Jingru Dai, Huimin Lu, Zhijin Cai et al. · Rare Metals · 2013 · 15 citations

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